Copper Plating is the process of the plating layer of copper electrolytically on the surface of an item it takes place in an
electrolytic which uses a direct electric current to dissolve a copper rod and transport the copper ions to the item.
As the copper ions dissolve into the water, they form a coordination complex with salts already present.
The copper then physically flows to the item, where it is reduced to the metallic state by gaining electrons.

This forms a thin, solid, metallic copper film on the surface of the item.